Hardware Engineer

Location: On-site Lviv

Contract Type: Full-time

ABOUT THE PROJECT:

We are developing a compact, high-performance Single Board Computer (SBC) for UAV and UGV applications. The platform is intended for onboard AI processing, computer vision, autonomous navigation, sensor fusion, video processing, and real-time communication in demanding environments.

The project involves designing and validating custom carrier boards and complete SBC solutions based on Qualcomm, Rockchip, and NXP processors, including integration with AI accelerators via M.2.

Key Responsibilities

• Design schematics for complex digital and analog electronic devices.
• Design power supply systems, high-speed interfaces, and peripheral circuits.
• Develop hardware based on modern SoCs such as Qualcomm, Rockchip, NXP, or equivalent platforms.
• Select components based on technical requirements, cost, availability, lifecycle, and supply considerations.
• Prepare BOMs, engineering documentation, and technical specifications.
• Conduct internal Design Reviews and resolve design issues before PCB Layout.
• Work closely with PCB Layout Engineers during PCB development and routing.
• Support prototype manufacturing, hardware bring-up, and debugging.
• Analyze issues identified during testing and implement design improvements.
• Collaborate with Embedded Software, Mechanical Design, Manufacturing, and Test Engineering teams.
• Contribute to hardware architecture and technical decisions throughout the product development cycle.
  
  Required Qualifications
• Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, or a related technical field.
• 5+ years of professional experience in electronic hardware design.
• Strong proficiency with modern CAD tools such as Cadence Allegro / OrCAD, Altium Designer, or equivalent.
• Strong understanding of analog and digital circuit design.
• Hands-on experience with high-speed interfaces, including:
  
  • DDR3 / DDR4 / LPDDR4(X)
  • MIPI CSI / DSI
  • USB 2.0 / USB 3.x
  • PCI Express
  • Ethernet (RGMII / RMII / SGMII)
  • HDMI, DisplayPort, or LVDS
• Experience designing multilayer PCBs (8–12+ layers).
• Solid understanding of Signal Integrity (SI) and Power Integrity (PI).
• Experience designing power systems using PMICs, DC/DC converters, and LDOs.
• Ability to analyze and apply datasheets, Hardware Design Guides, and Reference Designs.
• Hands-on experience using laboratory equipment, including oscilloscopes, logic analyzers, laboratory power supplies, and multimeters.
• Strong engineering problem-solving and analytical skills.
• Ability to independently make and justify technical decisions.
  
  PREFERRED QUALIFICATIONS
• Experience with Qualcomm (QCS/QCM), Rockchip, or NXP SoCs.
• Experience designing Single Board Computers (SBCs).
• Experience with MIPI camera and display interfaces.
• Experience integrating Wi-Fi, Bluetooth, GNSS, LTE/5G modules.
• Knowledge of Design for Manufacturing (DFM) and Design for Test (DFT) principles.
• Experience with EMC/EMI testing and compliance.
• Understanding of NDAA requirements and experience working with components from Western manufacturers.
• Experience preparing hardware products for mass production.
• Experience with hardware bring-up, board-level debugging, and root-cause analysis.
  
  SOFT SKILLS & TEAM FIT:
  
  • Strong analytical and problem-solving skills
  • Excellent written and verbal communication
  • Comfortable working in cross-functional teams under tight deadlines
  • Self-motivated, detail-oriented, and able to thrive in high-stakes environments
  WHAT WE OFFER
  
  • The opportunity to shape a mission-critical defense technology from the ground up
  • Be part of a compact, elite engineering team with full-cycle product ownership
  • A fast-paced result-oriented culture where decisions are driven by data and results
  • Competitive compensation
  • Access to field testing, prototyping labs, and autonomy in solving complex problems
  • Direct impact on Ukraine’s national security and technological edge

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