Project Foundation launched by The Fourth Law and Odd Systems is a semiconductor initiative to mass-produce thermal imaging sensors for Ukraine, the rest of Europe and the United States.
The initiative covers the development of LWIR sensors and the deployment of a network of partner-operated and in-house manufacturing facilities. It will create a new industrial base for defense and civilian needs and supply affordable sensors to manufacturers of drones, vehicles, and robotics.
The first sensors under the initiative are expected as early as 2027.
The Fourth Law is a leading Ukrainian manufacturer of autonomy technologies for drones. Our solutions are codified according to NATO standards and are currently utilized by over 50 units of the Security and Defense Forces of Ukraine, as well as 20+ drone manufacturers.
Odd Systems is a defense technology company specializing in the development and manufacturing of thermal imaging cameras. It was founded by a group of entrepreneurs, engineers, managers, and tech enthusiasts with prior experience at a number of international technology companies.
Purpose of the Role:
The IC/MEMS Integration and Simulation Engineer is responsible for designing the microbolometer MEMS architecture and the electrical and mechanical interface with the Readout Integrated Circuit (ROIC). This is a hands-on role involving the design of the microbolometer layout and the redistribution layer (RDL) -ensuring precise alignment between pixel attachment points and the fixed pad array on the ROIC — as well as performing finite element analysis to verify that the resulting structure can withstand the mechanical and thermal loads encountered during packaging and operation. The engineer works closely with a MEMS/semiconductor processing specialist and the broader technical team at the R&D laboratory in Eindhoven, and reports directly to the Chief Technology Officer (CTO).
Office location:
Eindhoven, the Netherlands
Key Responsibilities:
• Own MEMS design and layout adjustments that reconcile the microbolometer pixel array with the fixed ROIC pad configuration.
• Match microbolometer pixel anchor points precisely to predefined ROIC pad locations, iterating layout across design revisions.
• Build and run FEA models of mechanical behavior, including residual stress and the structural integrity of suspended pixel structures.
• Simulate thermal behavior across the packaging cycle — die attach, curing, wire bonding, lid sealing — to flag stress or delamination risk before fabrication.
• Feed simulation results back into layout and process decisions, working closely with the MEMS/Semiconductor Processing Specialist and packaging partners.
• Maintain design documentation and simulation records to support Gen0 qualification and future design iterations.
Experience and skills we are looking for:
• A degree in electrical engineering, microelectronics, or a related field, with hands-on IC layout experience (RDL design a plus).
• Practical experience with FEA tools (e.g. ANSYS, COMSOL) for mechanical and thermal simulation of microstructures or packaged devices.
• Understanding of MEMS pixel structures, ROIC pad/bump interfaces, and the constraints of hybrid integration.
• Comfortable working from first principles in a pre-production environment — this is a build-it-yourself role, not a mature-process one.
• Fluent English, with the communication maturity to work with an international, partly Ukrainian team.
It’s a plus if you have:
• Prior work on microbolometer, IR sensor, or other MEMS-ROIC hybrid integration.
• Experience with wafer-level or die-level hybrid bonding processes and their mechanical failure modes.
• Familiarity with JEDEC packaging formats and wire-bond or bump interconnect design rules.
• Based in, or willing to relocate to, Eindhoven for the Odd Factory One R&D lab.
We are not just looking for employees, but for like-minded individuals who share our values and are ready to build the future of Ukrainian MilTech.
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